LGJul 18, 2022
Vertical GaN Diode BV Maximization through Rapid TCAD Simulation and ML-enabled Surrogate ModelAlbert Lu, Jordan Marshall, Yifan Wang et al.
In this paper, two methodologies are used to speed up the maximization of the breakdown volt-age (BV) of a vertical GaN diode that has a theoretical maximum BV of ~2100V. Firstly, we demonstrated a 5X faster accurate simulation method in Technology Computer-Aided-Design (TCAD). This allows us to find 50% more numbers of high BV (>1400V) designs at a given simulation time. Secondly, a machine learning (ML) model is developed using TCAD-generated data and used as a surrogate model for differential evolution optimization. It can inversely design an out-of-the-training-range structure with BV as high as 1887V (89% of the ideal case) compared to ~1100V designed with human domain expertise.
LGApr 3, 2023
Device Image-IV Mapping using Variational Autoencoder for Inverse Design and Forward PredictionThomas Lu, Albert Lu, Hiu Yung Wong
This paper demonstrates the learning of the underlying device physics by mapping device structure images to their corresponding Current-Voltage (IV) characteristics using a novel framework based on variational autoencoders (VAE). Since VAE is used, domain expertise is not required and the framework can be quickly deployed on any new device and measurement. This is expected to be useful in the compact modeling of novel devices when only device cross-sectional images and electrical characteristics are available (e.g. novel emerging memory). Technology Computer-Aided Design (TCAD) generated and hand-drawn Metal-Oxide-Semiconductor (MOS) device images and noisy drain-current-gate-voltage curves (IDVG) are used for the demonstration. The framework is formed by stacking two VAEs (one for image manifold learning and one for IDVG manifold learning) which communicate with each other through the latent variables. Five independent variables with different strengths are used. It is shown that it can perform inverse design (generate a design structure for a given IDVG) and forward prediction (predict IDVG for a given structure image, which can be used for compact modeling if the image is treated as device parameters) successfully. Since manifold learning is used, the machine is shown to be robust against noise in the inputs (i.e. using hand-drawn images and noisy IDVG curves) and not confused by weak and irrelevant independent variables.
LGAug 15, 2024
Physics-Informed Neural Network for Predicting Out-of-Training-Range TCAD Solution with Minimized Domain ExpertiseAlbert Lu, Yu Foon Chau, Hiu Yung Wong
Machine learning (ML) is promising in assisting technology computer-aided design (TCAD) simulations to alleviate difficulty in convergence and prolonged simulation time. While ML is widely used in TCAD, they either require access to the internal solver, require extensive domain expertise, are only trained by terminal quantities such as currents and voltages, and/or lack out-of-training-range prediction capability. In this paper, using Si nanowire as an example, we demonstrate that it is possible to use a physics-informed neural network (PINN) to predict out-of-training-range TCAD solutions without accessing the internal solver and with minimal domain expertise. The machine not only can predict a 2.5 times larger range than the training but also can predict the inversion region by only being trained with subthreshold region data. The physics-informed module is also trained with data without the need for human-coded equations making this easier to be extended to more sophisticated systems.
40.2QUANT-PHMar 19
Review of Superconducting Qubit Devices and Their Large-Scale IntegrationHiu Yung Wong
The superconducting qubit quantum computer is one of the most promising quantum computing architectures for large-scale integration due to its maturity and close proximity to the well-established semiconductor manufacturing infrastructure. From an education perspective, it also bridges classical microwave electronics and quantum electrodynamics. In this paper, we will review the basics of quantum computers, superconductivity, and Josephson junctions. We then introduce important technologies and concepts related to DiVincenzo's criteria, which are the necessary conditions for the superconducting qubits to work as a useful quantum computer. Firstly, we will discuss various types of superconducting qubits formed with Josephson junctions, from which we will understand the trade-off across multiple design parameters, including their noise immunity. Secondly, we will discuss different schemes to achieve entanglement gate operations, which are a major bottleneck in achieving more efficient fault-tolerant quantum computing. Thirdly, we will review readout engineering, including the implementations of the Purcell filters and quantum-limited amplifiers. Finally, we will discuss the nature and review the studies of two-level system defects, which are currently the limiting factor of qubit coherence time. DiVincenzo's criteria are only the necessary conditions for a technology to be eligible for quantum computing. To have a useful quantum computer, large-scale integration is required. We will review proposals and developments for the large-scale integration of superconducting qubit devices. By comparing with the application of electronic design automation (EDA) in semiconductors, we will also review the use of EDA in superconducting qubit quantum computer design, which is necessary for its large-scale integration.
ARFeb 15, 2024
Stuck-at Faults in ReRAM Neuromorphic Circuit Array and their Correction through Machine LearningVedant Sawal, Hiu Yung Wong
In this paper, we study the inference accuracy of the Resistive Random Access Memory (ReRAM) neuromorphic circuit due to stuck-at faults (stuck-on, stuck-off, and stuck at a certain resistive value). A simulation framework using Python is used to perform supervised machine learning (neural network with 3 hidden layers, 1 input layer, and 1 output layer) of handwritten digits and construct a corresponding fully analog neuromorphic circuit (4 synaptic arrays) simulated by Spectre. A generic 45nm Process Development Kit (PDK) was used. We study the difference in the inference accuracy degradation due to stuck-on and stuck-off defects. Various defect patterns are studied including circular, ring, row, column, and circular-complement defects. It is found that stuck-on and stuck-off defects have a similar effect on inference accuracy. However, it is also found that if there is a spatial defect variation across the columns, the inference accuracy may be degraded significantly. We also propose a machine learning (ML) strategy to recover the inference accuracy degradation due to stuck-at faults. The inference accuracy is improved from 48% to 85% in a defective neuromorphic circuit.
NESep 14, 2025
Application of Machine Learning for Correcting Defect-induced Neuromorphic Circuit Inference ErrorsVedant Sawal, Hiu Yung Wong
This paper presents a machine learning-based approach to correct inference errors caused by stuck-at faults in fully analog ReRAM-based neuromorphic circuits. Using a Design-Technology Co-Optimization (DTCO) simulation framework, we model and analyze six spatial defect types-circular, circular-complement, ring, row, column, and checkerboard-across multiple layers of a multi-array neuromorphic architecture. We demonstrate that the proposed correction method, which employs a lightweight neural network trained on the circuit's output voltages, can recover up to 35% (from 55% to 90%) inference accuracy loss in defective scenarios. Our results, based on handwritten digit recognition tasks, show that even small corrective networks can significantly improve circuit robustness. This method offers a scalable and energy-efficient path toward enhanced yield and reliability for neuromorphic systems in edge and internet-of-things (IoTs) applications. In addition to correcting the specific defect types used during training, our method also demonstrates the ability to generalize-achieving reasonable accuracy when tested on different types of defects not seen during training. The framework can be readily extended to support real-time adaptive learning, enabling on-chip correction for dynamic or aging-induced fault profiles.
LGApr 3, 2025
Ga$_2$O$_3$ TCAD Mobility Parameter Calibration using Simulation Augmented Machine Learning with Physics Informed Neural NetworkLe Minh Long Nguyen, Edric Ong, Matthew Eng et al.
In this paper, we demonstrate the possibility of performing automatic Technology Computer-Aided-Design (TCAD) parameter calibration using machine learning, verified with experimental data. The machine only needs to be trained by TCAD data. Schottky Barrier Diode (SBD) fabricated with emerging ultra-wide-bandgap material, Gallium Oxide (Ga$_2$O$_3$), is measured and its current-voltage (IV) is used for Ga$_2$O$_3$ Philips Unified Mobility (PhuMob) model parameters, effective anode workfunction, and ambient temperature extraction (7 parameters). A machine comprised of an autoencoder (AE) and a neural network (NN) (AE-NN) is used. Ga$_2$O$_3$ PhuMob parameters are extracted from the noisy experimental curves. TCAD simulation with the extracted parameters shows that the quality of the parameters is as good as an expert's calibration at the pre-turned-on regime but not in the on-state regime. By using a simple physics-informed neural network (PINN) (AE-PINN), the machine performs as well as the human expert in all regimes.