Tianrui Ma

AR
h-index26
4papers
6citations
Novelty60%
AI Score48

4 Papers

74.1LGMay 22Code
BitsMoE: Efficient Spectral Energy-Guided Bit Allocation for MoE LLM Quantization

Jiayu Zhao, Zihan Teng, Minhao Fan et al.

Mixture-of-Experts (MoE) large language models reduce per-token computation through sparse expert activation, but their deployment remains memory-intensive because all expert weights must be kept resident in memory. Existing MoE compression methods struggle in the ultra-low-bit regime: pruning irreversibly removes model capacity, while coarse-grained quantization fails to allocate bits according to heterogeneous expert and weight-direction importance. We propose BitsMoE, a spectral-energy-guided bit-allocation framework for MoE LLM quantization. BitsMoE decomposes each MoE layer by SVD into a shared basis and expert-specific spectral factors, retaining the shared basis without quantization to preserve common cross-expert structure and using the expert-specific factors as fine-grained quantization units. To determine the bit-width of each unit, BitsMoE formulates spectrum-wise mixed-precision quantization as an activation-aware reconstruction surrogate and solves an integer linear program that minimizes estimated reconstruction loss under a fixed bit budget. Experiments across multiple MoE LLMs show that BitsMoE substantially reduces downstream task accuracy degradation in ultra-low-bit regimes. Under 2-bit quantization on Qwen3-30B-A3B-Base, BitsMoE accelerates quantization by 12.3$\times$, improves average accuracy by 27.83 percentage points, and increases decoding speed by 1.76$\times$ over GPTQ. Our model and code are publicly available at https://github.com/zjiayu064/BitsMoE.

CVApr 6, 2025Code
SnapPix: Efficient-Coding--Inspired In-Sensor Compression for Edge Vision

Weikai Lin, Tianrui Ma, Adith Boloor et al.

Energy-efficient image acquisition on the edge is crucial for enabling remote sensing applications where the sensor node has weak compute capabilities and must transmit data to a remote server/cloud for processing. To reduce the edge energy consumption, this paper proposes a sensor-algorithm co-designed system called SnapPix, which compresses raw pixels in the analog domain inside the sensor. We use coded exposure (CE) as the in-sensor compression strategy as it offers the flexibility to sample, i.e., selectively expose pixels, both spatially and temporally. SNAPPIX has three contributions. First, we propose a task-agnostic strategy to learn the sampling/exposure pattern based on the classic theory of efficient coding. Second, we co-design the downstream vision model with the exposure pattern to address the pixel-level non-uniformity unique to CE-compressed images. Finally, we propose lightweight augmentations to the image sensor hardware to support our in-sensor CE compression. Evaluating on action recognition and video reconstruction, SnapPix outperforms state-of-the-art video-based methods at the same speed while reducing the energy by up to 15.4x. We have open-sourced the code at: https://github.com/horizon-research/SnapPix.

ARJun 5, 2025
QiMeng: Fully Automated Hardware and Software Design for Processor Chip

Rui Zhang, Yuanbo Wen, Shuyao Cheng et al.

Processor chip design technology serves as a key frontier driving breakthroughs in computer science and related fields. With the rapid advancement of information technology, conventional design paradigms face three major challenges: the physical constraints of fabrication technologies, the escalating demands for design resources, and the increasing diversity of ecosystems. Automated processor chip design has emerged as a transformative solution to address these challenges. While recent breakthroughs in Artificial Intelligence (AI), particularly Large Language Models (LLMs) techniques, have opened new possibilities for fully automated processor chip design, substantial challenges remain in establishing domain-specific LLMs for processor chip design. In this paper, we propose QiMeng, a novel system for fully automated hardware and software design of processor chips. QiMeng comprises three hierarchical layers. In the bottom-layer, we construct a domain-specific Large Processor Chip Model (LPCM) that introduces novel designs in architecture, training, and inference, to address key challenges such as knowledge representation gap, data scarcity, correctness assurance, and enormous solution space. In the middle-layer, leveraging the LPCM's knowledge representation and inference capabilities, we develop the Hardware Design Agent and the Software Design Agent to automate the design of hardware and software for processor chips. Currently, several components of QiMeng have been completed and successfully applied in various top-layer applications, demonstrating significant advantages and providing a feasible solution for efficient, fully automated hardware/software design of processor chips. Future research will focus on integrating all components and performing iterative top-down and bottom-up design processes to establish a comprehensive QiMeng system.

ARAug 22, 2025
Hardwired-Neurons Language Processing Units as General-Purpose Cognitive Substrates

Yang Liu, Yi Chen, Yongwei Zhao et al.

The rapid advancement of Large Language Models (LLMs) has established language as a core general-purpose cognitive substrate, driving the demand for specialized Language Processing Units (LPUs) tailored for LLM inference. To overcome the growing energy consumption of LLM inference systems, this paper proposes a Hardwired-Neurons Language Processing Unit (HNLPU), which physically hardwires LLM weight parameters into the computational fabric, achieving several orders of magnitude computational efficiency improvement by extreme specialization. However, a significant challenge still lies in the scale of modern LLMs. An ideal estimation on hardwiring gpt-oss 120 B requires fabricating at least 6 billion dollars of photomask sets, rendering the straightforward solution economically impractical. Addressing this challenge, we propose the novel Metal-Embedding methodology. Instead of embedding weights in a 2D grid of silicon device cells, Metal-Embedding embeds weight parameters into the 3D topology of metal wires. This brings two benefits: (1) a 15x increase in density, and (2) 60 out of 70 layers of photomasks are made homogeneous across chips, including all EUV photomasks. In total, Metal-Embedding reduced the photomask cost by 112x, bringing the Non-Recurring Engineering (NRE) cost of HNLPU into an economically viable range. Experimental results show that HNLPU achieved 249,960 tokens/s (5,555x/85x of GPU/WSE), 36 tokens/J (1,047x/283x of GPU/WSE), 13,232 mm2 total die area (29% inscribed rectangular area in a 300 mm wafer), \$184M estimated NRE at 5 nm technology. Analysis shows that HNLPU achieved 8.57x cost-effectiveness and 230x carbon footprint reduction compared to H100 clusters, under an annual weight updating assumption.