Hongjian Zhou, Haoyu Yang, Haoxing Ren et al.
As AI systems scale to multi-chiplet and wafer-level architectures, the demand for ultra-high bandwidth and system scalability has outpaced the capabilities of electrical interconnects and computing units. Large-scale heterogeneous electronic-photonic integrated chiplets (EPICs) provide a promising solution, but their practical adoption is limited by the lack of a unified, fabrication-aware physical design automation stack. At the same time, inverse-designed ultra-compact photonic devices offer orders-of-magnitude improvements in spatial and spectral density, yet remain constrained by insufficient design-for-manufacturing support and yield optimization. In this work, we present OptoSynthesizer, an end-to-end physical design automation flow for yield-optimized, inverse-designed EPICs. It integrates three key components across the physical design pipeline: (1) OptoSynthesizer-InvDes, a physical-AI-augmented, digital-twin-assisted photonic inverse design and photonics-aware inverse lithography framework; (2) OptoSynthesizer-Place, a GPU-accelerated routing-informed EPIC placer for large-scale routability-optimized layout; and (3) OptoSynthesizer-Route, a hierarchical curvy-aware waveguide router with global-planning-assisted electrical-optical co-routing. Together, these toolkits form a seamless flow from EPIC netlists to fabrication-ready, yield-robust GDS layouts. We demonstrate how this framework enables compact large-scale photonic tensor cores and high-bandwidth interconnect fabrics for heterogeneous EPIC platforms, providing a practical foundation for manufacturable large-scale EPICs in next-generation AI systems.