Yunqi Shi

Yunqi Shi, Ke Xue, Lei Song et al.

The development of very large-scale integration (VLSI) technology has posed new challenges for electronic design automation (EDA) techniques in chip floorplanning. During this process, macro placement is an important subproblem, which tries to determine the positions of all macros with the aim of minimizing half-perimeter wirelength (HPWL) and avoiding overlapping. Previous methods include packing-based, analytical and reinforcement learning methods. In this paper, we propose a new black-box optimization (BBO) framework (called WireMask-BBO) for macro placement, by using a wire-mask-guided greedy procedure for objective evaluation. Equipped with different BBO algorithms, WireMask-BBO empirically achieves significant improvements over previous methods, i.e., achieves significantly shorter HPWL by using much less time. Furthermore, it can fine-tune existing placements by treating them as initial solutions, which can bring up to 50% improvement in HPWL. WireMask-BBO has the potential to significantly improve the quality and efficiency of chip floorplanning, which makes it appealing to researchers and practitioners in EDA and will also promote the application of BBO. Our code is available at https://github.com/lamda-bbo/WireMask-BBO.

Yunqi Shi, Xi Lin, Zhiang Wang et al.

This work introduces the Re$^{\text{2}}$MaP method, which generates expert-quality macro placements through recursively prototyping and packing tree-based relocating. We first perform multi-level macro grouping and PPA-aware cell clustering to produce a unified connection matrix that captures both wirelength and dataflow among macros and clusters. Next, we use DREAMPlace to build a mixed-size placement prototype and obtain reference positions for each macro and cluster. Based on this prototype, we introduce ABPlace, an angle-based analytical method that optimizes macro positions on an ellipse to distribute macros uniformly near chip periphery, while optimizing wirelength and dataflow. A packing tree-based relocating procedure is then designed to jointly adjust the locations of macro groups and the macros within each group, by optimizing an expertise-inspired cost function that captures various design constraints through evolutionary search. Re$^{\text{2}}$MaP repeats the above process: Only a subset of macro groups are positioned in each iteration, and the remaining macros are deferred to the next iteration to improve the prototype's accuracy. Using a well-established backend flow with sufficient timing optimizations, Re$^{\text{2}}$MaP achieves up to 22.22% (average 10.26%) improvement in worst negative slack (WNS) and up to 97.91% (average 33.97%) improvement in total negative slack (TNS) compared to the state-of-the-art academic placer Hier-RTLMP. It also ranks higher on WNS, TNS, power, design rule check (DRC) violations, and runtime than the conference version ReMaP, across seven tested cases. Our code is available at https://github.com/lamda-bbo/Re2MaP.

Ruo-Tong Chen, Ke Xue, Chengrui Gao et al.

Chip placement is a critical step in physical design. While reinforcement learning (RL)-based methods have recently emerged, their training primarily focuses on wirelength optimization, and therefore often fail to achieve expert-quality layouts. We identify the reward design as the primary cause for the performance gap with experts, and instead of formalizing intricate processes, we circumvent this by directly learning from expert layouts to derive a reward model. Our approach starts from the final expert layouts to infer step-by-step expert trajectories. Using these trajectories as demonstrations or preferences, we train a model that captures the latent implicit rewards in expert results. Experiments show that our framework can efficiently learn from even a single design and generalize well to unseen cases.

Ke Xue, Ruo-Tong Chen, Xi Lin et al.

In modern chip design, placement aims at placing millions of circuit modules, which is an essential step that significantly influences power, performance, and area (PPA) metrics. Recently, reinforcement learning (RL) has emerged as a promising technique for improving placement quality, especially macro placement. However, current RL-based placement methods suffer from long training times, low generalization ability, and inability to guarantee PPA results. A key issue lies in the problem formulation, i.e., using RL to place from scratch, which results in limits useful information and inaccurate rewards during the training process. In this work, we propose an approach that utilizes RL for the refinement stage, which allows the RL policy to learn how to adjust existing placement layouts, thereby receiving sufficient information for the policy to act and obtain relatively dense and precise rewards. Additionally, we introduce the concept of regularity during training, which is considered an important metric in the chip design industry but is often overlooked in current RL placement methods. We evaluate our approach on the ISPD 2005 and ICCAD 2015 benchmark, comparing the global half-perimeter wirelength and regularity of our proposed method against several competitive approaches. Besides, we test the PPA performance using commercial software, showing that RL as a regulator can achieve significant PPA improvements. Our RL regulator can fine-tune placements from any method and enhance their quality. Our work opens up new possibilities for the application of RL in placement, providing a more effective and efficient approach to optimizing chip design. Our code is available at \url{https://github.com/lamda-bbo/macro-regulator}.

Yunqi Shi, Chengrui Gao, Wanqi Ren et al.

This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design.

Ke Xue, Ruo-Tong Chen, Rong-Xi Tan et al.

Chip placement is a vital stage in modern chip design as it has a substantial impact on the subsequent processes and the overall quality of the final chip. The use of black-box optimization (BBO) for chip placement has a history of several decades. However, early efforts were limited by immature problem formulations and inefficient algorithm designs. Recent progress has shown the effectiveness and efficiency of BBO for chip placement, proving its potential to achieve state-of-the-art results. Despite these advancements, the field lacks a unified, BBO-specific benchmark for thoroughly assessing various problem formulations and BBO algorithms. To fill this gap, we propose BBOPlace-Bench, the first benchmark designed specifically for evaluating and developing BBO algorithms for chip placement tasks. It integrates three problem formulations of BBO for chip placement, and offers a modular, decoupled, and flexible framework that enables users to seamlessly implement, test, and compare their own algorithms. BBOPlace-Bench integrates a wide variety of existing BBO algorithms, including simulated annealing (SA), evolutionary algorithms (EAs), and Bayesian optimization (BO). Experimental results show that the problem formulations of mask-guided optimization and hyperparameter optimization exhibit superior performance than the sequence pair problem formulation, while EAs demonstrate better overall performance than SA and BO, especially in high-dimensional search spaces, and also achieve state-of-the-art performance compared to the mainstream chip placement methods. BBOPlace-Bench not only facilitates the development of efficient BBO-driven solutions for chip placement but also broadens the practical application scenarios (which are urgently needed) for the BBO community. The code of BBOPlace-Bench is available at https://github.com/lamda-bbo/BBOPlace-Bench.

Chen Lu, Ke Xue, Chengrui Gao et al.

With the rapid advancement of human science and technology, problems in industrial scenarios are becoming increasingly challenging, bringing significant challenges to traditional algorithm design. Automated algorithm design with LLMs emerges as a promising solution, but the currently adopted black-box modeling deprives LLMs of any awareness of the intrinsic mechanism of the target problem, leading to hallucinated designs. In this paper, we introduce Evolutionary Stagewise Algorithm Design (EvoStage), a novel evolutionary paradigm that bridges the gap between the rigorous demands of industrial-scale algorithm design and the LLM-based algorithm design methods. Drawing inspiration from CoT, EvoStage decomposes the algorithm design process into sequential, manageable stages and integrates real-time intermediate feedback to iteratively refine algorithm design directions. To further reduce the algorithm design space and avoid falling into local optima, we introduce a multi-agent system and a "global-local perspective" mechanism. We apply EvoStage to the design of two types of common optimizers: designing parameter configuration schedules of the Adam optimizer for chip placement, and designing acquisition functions of Bayesian optimization for black-box optimization. Experimental results across open-source benchmarks demonstrate that EvoStage outperforms human-expert designs and existing LLM-based methods within only a couple of evolution steps, even achieving the historically state-of-the-art half-perimeter wire-length results on every tested chip case. Furthermore, when deployed on a commercial-grade 3D chip placement tool, EvoStage significantly surpasses the original performance metrics, achieving record-breaking efficiency. We hope EvoStage can significantly advance automated algorithm design in the real world, helping elevate human productivity.

Peng Xie, Ke Xue, Yunqi Shi et al.

Chip placement plays an important role in physical design. While generative models like diffusion models offer promising learning-based solutions, current methods have the following limitations: they use random synthetic data for pre-training, require long sampling times, and often result in overlaps due to their dependence on gradient-based solvers during the sampling process. To overcome these issues, we propose FlowPlace, which features mask-guided synthetic data generation, flow-based efficient training with flexible prior injection, and hard constraint sampling for overlap-free layouts. Experiments on OpenROAD and ICCAD 2015 benchmarks show FlowPlace achieves better PPA metrics, 10-50$\times$ faster sampling efficiency, and zero overlaps.

Yunqi Shi, Siyuan Xu, Shixiong Kai et al.

Timing optimization during the global placement of integrated circuits has been a significant focus for decades, yet it remains a complex, unresolved issue. Recent analytical methods typically use pin-level timing information to adjust net weights, which is fast and simple but neglects the path-based nature of the timing graph. The existing path-based methods, however, cannot balance the accuracy and efficiency due to the exponential growth of number of critical paths. In this work, we propose a GPU-accelerated timing-driven global placement framework, integrating accurate path-level information into the efficient DREAMPlace infrastructure. It optimizes the fine-grained pin-to-pin attraction objective and is facilitated by efficient critical path extraction. We also design a quadratic distance loss function specifically to align with the RC timing model. Experimental results demonstrate that our method significantly outperforms the current leading timing-driven placers, achieving an average improvement of 40.5% in total negative slack (TNS) and 8.3% in worst negative slack (WNS), as well as an improvement in half-perimeter wirelength (HPWL).

Ke Xue, Xi Lin, Yunqi Shi et al.

Placement is crucial in the physical design, as it greatly affects power, performance, and area metrics. Recent advancements in analytical methods, such as DREAMPlace, have demonstrated impressive performance in global placement. However, DREAMPlace has some limitations, e.g., may not guarantee legalizable placements under the same settings, leading to fragile and unpredictable results. This paper highlights the main issue as being stuck in local optima, and proposes a hybrid optimization framework to efficiently escape the local optima, by perturbing the placement result iteratively. The proposed framework achieves significant improvements compared to state-of-the-art methods on two popular benchmarks.