Noelle Crawford

Yiqi Liu, Noelle Crawford, Michael Wang et al.

To overcome the well-known memory bottleneck of AI chips, 3D stacked architectures that employ advanced packaging technology with high-density through-silicon vias (TSVs) pins have proven to be a promising solution. The 3D-stacked AI chip enables ultra-high memory bandwidth between compute and memory by stacking numerous DRAM banks atop many AI cores in a distributed manner. However, it is not easy to explore the efficiency of the 3D-stacked AI chip, due to its unique distributed nature. And we need to carefully consider multiple intertwined factors that range from upper-level computing paradigm to machine learning (ML) compiler optimizations, and to the underlying hardware architecture. In this paper, we develop Voxel, a fast and compiler-aware end-to-end simulation framework to facilitate exploring the efficiency of 3D-stacked AI chips for large language model (LLM) inference. Voxel enables the software/hardware co-exploration by employing a programming interface that allows ML compilers to customize the model execution plans. After validating the results of Voxel with an emulator on real silicon, we thoroughly examine the impact and correlation of different aspects of 3D-stacked AI chips, including state-of-the-art compute paradigms, tile-to-core mapping, tensor-to-bank mapping, NoC topologies and link bandwidth, DRAM bank bandwidth, per-core SRAM capacity, and energy/thermal constraints. Our findings disclose that the end-to-end efficiency of a 3D stacked AI chip not only is determined by the cooperative function of these factors, but also significantly depends on the mappings from tiles to AI core and DRAM banks. We report our findings throughout the paper, with the expectation that they will shed light on the development of the 3D-stacked AI chip ecosystem. We will open source Voxel and our study results for public research.

Yiqi Liu, Yuqi Xue, Noelle Crawford et al.

To meet the increasing demand of deep learning (DL) models, AI chips are employing both off-chip memory (e.g., HBM) and high-bandwidth low-latency interconnect for direct inter-core data exchange. However, it is not easy to explore the efficiency of these inter-core connected AI (ICCA) chips, due to a fundamental tussle among compute (per-core execution), communication (inter-core data exchange), and I/O (off-chip data access). In this paper, we develop Elk, a DL compiler framework to maximize the efficiency of ICCA chips by jointly trading off all the three performance factors discussed above. Elk structures these performance factors into configurable parameters and forms a global trade-off space in the DL compiler. To systematically explore this space and maximize overall efficiency, Elk employs a new inductive operator scheduling policy and a cost-aware on-chip memory allocation algorithm. It generates globally optimized execution plans that best overlap off-chip data loading and on-chip execution. To examine the efficiency of Elk, we build a full-fledged emulator based on a real ICCA chip IPU-POD4, and an ICCA chip simulator for sensitivity analysis with different interconnect network topologies. Elk achieves 94% of the ideal roofline performance of ICCA chips on average, showing the benefits of supporting large DL models on ICCA chips. We also show Elk's capability of enabling architecture design space exploration for new ICCA chip development.