Yanjing Yang

Yanjing Yang, Chenxing Zhong, Ke Han et al.

Large Language Model (LLM)-based agents increasingly rely on APIs to operate complex web applications, but rapid evolution often leads to incomplete or inconsistent API documentation. Existing work falls into two categories: (1) static, white-box approaches based on source code or formal specifications, and (2) dynamic, black-box approaches that infer APIs from runtime traffic. Static approaches rely on internal artifacts, which are typically unavailable for closed-source systems, and often over-approximate API usage, resulting in high false-positive rates. Although dynamic black-box API discovery applies broadly, its robustness degrades in complex environments where shared collection points aggregate traffic from multiple applications. To improve robustness under mixed runtime traffic, we propose APISENSOR, a black-box API discovery framework that reconstructs application APIs unsupervised. APISENSOR performs structured analysis over complex traffic, combining traffic denoising and normalization with a graph-based two-stage clustering process to recover accurate APIs. We evaluated APISENSOR across six web applications using over 10,000 runtime requests with simulated mixed-traffic noise. Results demonstrate that APISENSOR significantly improves discovery accuracy, achieving an average Group Accuracy Precision of 95.92% and an F1-score of 94.91%, outperforming state-of-the-art methods. Across different applications and noise settings, APISENSOR achieves the lowest performance variance and at most an 8.11-point FGA drop, demonstrating the best robustness among 10 baselines. Ablation studies confirm that each component is essential. Furthermore, APISENSOR revealed API documentation inconsistencies in a real application, later confirmed by community developers.

Ramanpreet S Pahwa, Soon Wee Ho, Ren Qin et al.

For over 40 years lithographic silicon scaling has driven circuit integration and performance improvement in the semiconductor industry. As silicon scaling slows down, the industry is increasingly dependent on IC package technologies to contribute to further circuit integration and performance improvements. This is a paradigm shift and requires the IC package industry to reduce the size and increase the density of internal interconnects on a scale which has never been done before. Traditional package characterization and process optimization relies on destructive techniques such as physical cross-sections and delayering to extract data from internal package features. These destructive techniques are not practical with today's advanced packages. In this paper we will demonstrate how data acquired non-destructively with a 3D X-ray microscope can be enhanced and optimized using machine learning, and can then be used to measure, characterize and optimize the design and production of buried interconnects in advanced IC packages. Test vehicles replicating 2.5D and HBM construction were designed and fabricated, and digital data was extracted from these test vehicles using 3D X-ray and machine learning techniques. The extracted digital data was used to characterize and optimize the design and production of the interconnects and demonstrates a superior alternative to destructive physical analysis. We report an mAP of 0.96 for 3D object detection, a dice score of 0.92 for 3D segmentation, and an average of 2.1um error for 3D metrology on the test dataset. This paper is the first part of a multi-part report.