J. Senthilnath

Bangjian Zhou, Pan Jieming, Maheswari Sivan et al.

With high device integration density and evolving sophisticated device structures in semiconductor chips, detecting defects becomes elusive and complex. Conventionally, machine learning (ML)-guided failure analysis is performed with offline batch mode training. However, the occurrence of new types of failures or changes in the data distribution demands retraining the model. During the manufacturing process, detecting defects in a single-pass online fashion is more challenging and favoured. This paper focuses on novel quantile online learning for semiconductor failure analysis. The proposed method is applied to semiconductor device-level defects: FinFET bridge defect, GAA-FET bridge defect, GAA-FET dislocation defect, and a public database: SECOM. From the obtained results, we observed that the proposed method is able to perform better than the existing methods. Our proposed method achieved an overall accuracy of 86.66% and compared with the second-best existing method it improves 15.50% on the GAA-FET dislocation defect dataset.

Aye Phyu Phyu Aung, Lucas Lum, Zhansen Shi et al.

In semiconductor manufacturing, defect detection and localization are critical to ensuring product quality and yield. While X-ray imaging is a reliable non-destructive testing method, it is memory-intensive and time-consuming for large-scale scanning, Magnetic Field Imaging (MFI) offers a more efficient means to localize regions of interest (ROI) for targeted X-ray scanning. However, the limited availability of MFI datasets due to proprietary concerns presents a significant bottleneck for training machine learning (ML) models using MFI. To address this challenge, we consider an ML-driven approach leveraging diffusion models with two physical constraints. We propose Physics Informed Generative Models for Magnetic Field Images (PI-GenMFI) to generate synthetic MFI samples by integrating specific physical information. We generate MFI images for the most common defect types: power shorts. These synthetic images will serve as training data for ML algorithms designed to localize defect areas efficiently. To evaluate generated MFIs, we compare our model to SOTA generative models from both variational autoencoder (VAE) and diffusion methods. We present a domain expert evaluation to assess the generated samples. In addition, we present qualitative and quantitative evaluation using various metrics used for image generation and signal processing, showing promising results to optimize the defect localization process.

J. Senthilnath, Jayasanker Jayabalan, Zhuoyi Lin et al.

The development of advanced packaging is essential in the semiconductor manufacturing industry. However, non-destructive testing (NDT) of advanced packaging becomes increasingly challenging due to the depth and complexity of the layers involved. In such a scenario, Magnetic field imaging (MFI) enables the imaging of magnetic fields generated by currents. For MFI to be effective in NDT, the magnetic fields must be converted into current density. This conversion has typically relied solely on a Fast Fourier Transform (FFT) for magnetic field inversion; however, the existing approach does not consider eddy current effects or image misalignment in the test setup. In this paper, we present a spatial-physics informed model (SPIM) designed for a 3D spiral sample scanned using Superconducting QUantum Interference Device (SQUID) microscopy. The SPIM encompasses three key components: i) magnetic image enhancement by aligning all the "sharp" wire field signals to mitigate the eddy current effect using both in-phase (I-channel) and quadrature-phase (Q-channel) images; (ii) magnetic image alignment that addresses skew effects caused by any misalignment of the scanning SQUID microscope relative to the wire segments; and (iii) an inversion method for converting magnetic fields to magnetic currents by integrating the Biot-Savart Law with FFT. The results show that the SPIM improves I-channel sharpness by 0.3% and reduces Q-channel sharpness by 25%. Also, we were able to remove rotational and skew misalignments of 0.30 in a real image. Overall, SPIM highlights the potential of combining spatial analysis with physics-driven models in practical applications.

J. Senthilnath, Chen Hao, F. C. Wellstood

In semiconductor packaging, accurately recovering 3D information is crucial for non-destructive testing (NDT) to localize circuit defects. This paper presents a novel approach called the 3D Magnetic Inverse Routine (3D MIR), which leverages Magnetic Field Images (MFI) to retrieve the parameters for the 3D current flow of a single-segment. The 3D MIR integrates a deep learning (DL)-based Convolutional Neural Network (CNN), spatial-physics-based constraints, and optimization techniques. The method operates in three stages: i) The CNN model processes the MFI data to predict ($\ell/z_o$), where $\ell$ is the wire length and $z_o$ is the wire's vertical depth beneath the magnetic sensors and classify segment type ($c$). ii) By leveraging spatial-physics-based constraints, the routine provides initial estimates for the position ($x_o$, $y_o$, $z_o$), length ($\ell$), current ($I$), and current flow direction (positive or negative) of the current segment. iii) An optimizer then adjusts these five parameters ($x_o$, $y_o$, $z_o$, $\ell$, $I$) to minimize the difference between the reconstructed MFI and the actual MFI. The results demonstrate that the 3D MIR method accurately recovers 3D information with high precision, setting a new benchmark for magnetic image reconstruction in semiconductor packaging. This method highlights the potential of combining DL and physics-driven optimization in practical applications.