Erik Schnaubelt

2papers

2 Papers

36.8ACC-PHMay 29Code
Explicit Turn Resolution with Anisotropic Homogenisation for Efficient 3D Magneto-Thermal Finite-Element Simulation of Large-Scale No-Insulation HTS Magnets

Louis Denis, Erik Schnaubelt, Julien Dular et al.

No-insulation (NI) and metal-insulation (MI) high-temperature superconducting (HTS) magnets require three-dimensional (3D) models to describe the current distribution around critical current defects. In this work, we design and validate the EXTRA homogenisation method, standing for explicit turn resolution with anisotropic homogenisation method. It allows 3D magneto-thermal finite-element (FE) simulations of large-scale magnets to be performed with high accuracy at a reasonable computational cost. The method combines the anisotropic homogenisation of turn-to-turn contact layers (T2TCLs) and their neighbouring winding turns with the explicit resolution of specific T2TCLs. In particular, the inner- and outermost winding turns and adjacent contact layers are explicitly resolved to properly describe the current distribution near current leads. In addition, the method is able to simulate local $J_{\textrm{c}}$ defects for a broad range of turn-to-turn contact resistances, provided the winding turns and T2TCLs next to the defect are explicitly resolved. For efficiency, the resolved T2TCLs are modelled using the surface contact approximation. The consistency of the proposed method is first verified on a 50-turn single pancake benchmark. It is shown to reproduce AC losses and temperature distributions obtained with a turn-resolved FE reference model, for both nominal operation and during thermal runaway. The computational efficiency of the EXTRA method is demonstrated with the simulation of a stack of three 150-turn pancake coils, for which computation time is reduced by a factor of up to 13 with respect to a turn-resolved FE reference model. Finally, the results of a large-scale 3D FE simulation, currently out of reach of turn-resolved models, are provided for an insert HTS magnet with 10,000 turns. The EXTRA method is open-source and input files to reproduce all results are made available.

31.3COMP-PHMay 27Code
Surface Contact Approximation for Magneto-Thermal Finite Element Analysis of No-Insulation HTS Coils

Erik Schnaubelt, Louis Denis, Mariusz Wozniak et al.

High-temperature superconducting (HTS) coated conductors (CCs) can be wound into no-insulation (NI) coils, in which electrical current can partially bypass local normal zones via turn-to-turn contact layers (T2TCLs). Accurate magneto-thermal simulation of such coils, therefore, requires an efficient representation of the electrical and thermal behavior of the T2TCLs. This paper introduces a magneto-thermal surface contact approximation (SCA) for finite element analysis of NI HTS coils. The formulation is derived as a special case of the more general thin shell approximation (TSA) by introducing suitable approximations such as negligible tangential surface currents and eddy-current effects inside the T2TCL. The resulting SCA formulation replaces the thin volumetric contact layer with a dedicated surface weak formulation based on the electric contact resistance and thermal contact conductance. In contrast, the TSA formulation requires the definition of electric resistivities and thermal conductivities as well as the thickness of the T2TCL. The SCA is implemented in the Pancake3D module of the free and open-source Finite Element Quench Simulator. It is verified through transient magneto-thermal simulations of a model NI pancake coil. Numerical results are compared against the established TSA formulation. The results show that the SCA accurately reproduces the relevant electromagnetic and thermal behavior. For the TSA, there is a trade-off between choosing large (potentially unphysical) thicknesses with low resistivities leading to inaccurate results, or small thicknesses with large resistivities making the linear system harder to solve, increasing the computational effort. In contrast, the SCA, thanks to using contact resistances and conductances directly without the necessity to define a thickness, is easy to use and robust.