Xudong Lu

Yuqi Jiang, Xudong Lu, Qian Jin et al.

Intelligence is key to advancing integrated circuit (IC) fabrication. Recent breakthroughs in Large Multimodal Models (LMMs) have unlocked extraditionary abilities in understanding images and text, fostering intelligent fabrication. Leveraging the power of LMMs, we introduce FabGPT, a customized IC fabrication large multimodal model for wafer defect knowledge query. FabGPT manifests expertise in conducting defect detection in Scanning Electron Microscope (SEM) images, performing root cause analysis, and providing expert Q&A on fabrication processes. FabGPT matches enhanced multimodal features to automatically detect minute defects under complex wafer backgrounds and reduce the subjectivity of manual threshold settings. Besides, the proposed modulation module and interactive corpus training strategy embed wafer defect knowledge into the pre-trained model, effectively balancing Q&A queries related to defect knowledge and original knowledge and mitigating the modality bias issues. Experiments on in-house fab data show that FabGPT achieves significant performance improvement in wafer defect detection and knowledge querying.

Xudong Lu, Zhi Zheng, Yi Wan et al.

Cross-View Geo-Localization (CVGL) focuses on identifying correspondences between images captured from distinct perspectives of the same geographical location. However, existing CVGL approaches are typically restricted to a single view or modality, and their direct visual matching strategy lacks interpretability: they only determine whether two images correspond, without explaining the rationale behind the match. In this paper, we present GLEAM-C, a foundational CVGL model that unifies multiple views and modalities-including UAV imagery, street maps, panoramic views, and ground photographs-by aligning them exclusively with satellite imagery. Our framework enhances training efficiency through optimized implementation while achieving accuracy comparable to prior modality-specific CVGL models through a two-phase training strategy. Moreover, to address the lack of interpretability in traditional CVGL methods, we leverage the reasoning capabilities of multimodal large language models (MLLMs) to propose a new task, GLEAM-X, which combines cross-view correspondence prediction with explainable reasoning. To support this task, we construct a bilingual benchmark using GPT-4o and Doubao-1.5-Thinking-Vision-Pro to generate training and testing data. The test set is further refined through detailed human revision, enabling systematic evaluation of explainable cross-view reasoning and advancing transparency and scalability in geo-localization. Together, GLEAM-C and GLEAM-X form a comprehensive CVGL pipeline that integrates multi-modal, multi-view alignment with interpretable correspondence analysis, unifying accurate cross-view matching with explainable reasoning and advancing Geo-Localization by enabling models to better Explain And Match. Code and datasets used in this work will be made publicly accessible at https://github.com/Lucky-Lance/GLEAM.

Qian Jin, Yuqi Jiang, Xudong Lu et al.

In the field of integrated circuit manufacturing, the detection and classification of nanoscale wafer defects are critical for subsequent root cause analysis and yield enhancement. The complex background patterns observed in scanning electron microscope (SEM) images and the diverse textures of the defects pose significant challenges. Traditional methods usually suffer from insufficient data, labels, and poor transferability. In this paper, we propose a novel few-shot learning approach, SEM-CLIP, for accurate defect classification and segmentation. SEM-CLIP customizes the Contrastive Language-Image Pretraining (CLIP) model to better focus on defect areas and minimize background distractions, thereby enhancing segmentation accuracy. We employ text prompts enriched with domain knowledge as prior information to assist in precise analysis. Additionally, our approach incorporates feature engineering with textual guidance to categorize defects more effectively. SEM-CLIP requires little annotated data, substantially reducing labor demands in the semiconductor industry. Extensive experimental validation demonstrates that our model achieves impressive classification and segmentation results under few-shot learning scenarios.