Hyunwoong Ko

Mutahar Safdar, Jiarui Xie, Hyunwoong Ko et al.

Data-driven research in Additive Manufacturing (AM) has gained significant success in recent years. This has led to a plethora of scientific literature to emerge. The knowledge in these works consists of AM and Artificial Intelligence (AI) contexts that have not been mined and formalized in an integrated way. Moreover, no tools or guidelines exist to support data-driven knowledge transfer from one context to another. As a result, data-driven solutions using specific AI techniques are being developed and validated only for specific AM process technologies. There is a potential to exploit the inherent similarities across various AM technologies and adapt the existing solutions from one process or problem to another using AI, such as Transfer Learning. We propose a three-step knowledge transferability analysis framework in AM to support data-driven AM knowledge transfer. As a prerequisite to transferability analysis, AM knowledge is featurized into identified knowledge components. The framework consists of pre-transfer, transfer, and post-transfer steps to accomplish knowledge transfer. A case study is conducted between flagship metal AM processes. Laser Powder Bed Fusion (LPBF) is the source of knowledge motivated by its relative matureness in applying AI over Directed Energy Deposition (DED), which drives the need for knowledge transfer as the less explored target process. We show successful transfer at different levels of the data-driven solution, including data representation, model architecture, and model parameters. The pipeline of AM knowledge transfer can be automated in the future to allow efficient cross-context or cross-process knowledge exchange.

Fatemeh Elhambakhsh, Daniele Grandi, Hyunwoong Ko

The conceptual design phase represents a critical early stage in the product development process, where designers generate potential solutions that meet predefined design specifications based on functional requirements. Functional modeling, a foundational aspect of this phase, enables designers to reason about product functions before specific structural details are determined. A widely adopted approach to functional modeling is the Function-Behavior-Structure (FBS) framework, which supports the transformation of functional intent into behavioral and structural descriptions. However, the effectiveness of function-based design is often hindered by the lack of well-structured and comprehensive functional data. This scarcity can negatively impact early design decision-making and hinder the development of accurate behavioral models. Recent advances in Large Language Models (LLMs), such as those based on GPT architectures, offer a promising avenue to address this gap. LLMs have demonstrated significant capabilities in language understanding and natural language processing (NLP), making them suitable for automated classification tasks. This study proposes a novel LLM-based domain adaptation (DA) framework using fine-tuning for the automated classification of mechanical assembly parts' functions. By fine-tuning LLMs on domain-specific datasets, the traditionally manual and subjective process of function annotation can be improved in both accuracy and consistency. A case study demonstrates fine-tuning GPT-3.5 Turbo on data from the Oregon State Design Repository (OSDR), and evaluation on the A Big CAD (ABC) dataset shows that the domain-adapted LLM can generate high-quality functional data, enhancing the semantic representation of mechanical parts and supporting more effective design exploration in early-phase engineering.

Tao Han, Zahra Taheri, Hyunwoong Ko

Semiconductor manufacturing relies heavily on film deposition processes, such as Chemical Vapor Deposition and Physical Vapor Deposition. These complex processes require precise control to achieve film uniformity, proper adhesion, and desired functionality. Recent advancements in Physics-Informed Neural Networks (PINNs), an innovative machine learning (ML) approach, have shown significant promise in addressing challenges related to process control, quality assurance, and predictive modeling within semiconductor film deposition and other manufacturing domains. This paper provides a comprehensive review of ML applications targeted at semiconductor film deposition processes. Through a thematic analysis, we identify key trends, existing limitations, and research gaps, offering insights into both the advantages and constraints of current methodologies. Our structured analysis aims to highlight the potential integration of these ML techniques to enhance interpretability, accuracy, and robustness in film deposition processes. Additionally, we examine state-of-the-art PINN methods, discussing strategies for embedding physical knowledge, governing laws, and partial differential equations into advanced neural network architectures tailored for semiconductor manufacturing. Based on this detailed review, we propose novel research directions that integrate the strengths of PINNs to significantly advance film deposition processes. The contributions of this study include establishing a clear pathway for future research in integrating physics-informed ML frameworks, addressing existing methodological gaps, and ultimately improving precision, scalability, and operational efficiency within semiconductor manufacturing.