Quan Chen

h-index6
2papers
116citations

2 Papers

2.6LGSep 25, 2024
A QoE-Aware Split Inference Accelerating Algorithm for NOMA-based Edge Intelligence

Xin Yuan, Ning Li, Quan Chen et al.

Even the AI has been widely used and significantly changed our life, deploying the large AI models on resource limited edge devices directly is not appropriate. Thus, the model split inference is proposed to improve the performance of edge intelligence, in which the AI model is divided into different sub models and the resource-intensive sub model is offloaded to edge server wirelessly for reducing resource requirements and inference latency. However, the previous works mainly concentrate on improving and optimizing the system QoS, ignore the effect of QoE which is another critical item for the users except for QoS. Even the QoE has been widely learned in EC, considering the differences between task offloading in EC and split inference in EI, and the specific issues in QoE which are still not addressed in EC and EI, these algorithms cannot work effectively in edge split inference scenarios. Thus, an effective resource allocation algorithm is proposed in this paper, for accelerating split inference in EI and achieving the tradeoff between inference delay, QoE, and resource consumption, abbreviated as ERA. Specifically, the ERA takes the resource consumption, QoE, and inference latency into account to find the optimal model split strategy and resource allocation strategy. Since the minimum inference delay and resource consumption, and maximum QoE cannot be satisfied simultaneously, the gradient descent based algorithm is adopted to find the optimal tradeoff between them. Moreover, the loop iteration GD approach is developed to reduce the complexity of the GD algorithm caused by parameter discretization. Additionally, the properties of the proposed algorithms are investigated, including convergence, complexity, and approximation error. The experimental results demonstrate that the performance of ERA is much better than that of the previous studies.

4.1LGMar 6, 2025
Neural Network Surrogate Model for Junction Temperature and Hotspot Position in $3$D Multi-Layer High Bandwidth Memory (HBM) Chiplets under Varying Thermal Conditions

Chengxin Zhang, Yujie Liu, Quan Chen

As the demand for computational power increases, high-bandwidth memory (HBM) has become a critical technology for next-generation computing systems. However, the widespread adoption of HBM presents significant thermal management challenges, particularly in multilayer through-silicon-via (TSV) stacked structures under varying thermal conditions, where accurate prediction of junction temperature and hotspot position is essential during the early design. This work develops a data-driven neural network model for the fast prediction of junction temperature and hotspot position in 3D HBM chiplets. The model, trained with a data set of $13,494$ different combinations of thermal condition parameters, sampled from a vast parameter space characterized by high-dimensional combination (up to $3^{27}$), can accurately and quickly infer the junction temperature and hotspot position for any thermal conditions in the parameter space. Moreover, it shows good generalizability for other thermal conditions not considered in the parameter space. The data set is constructed using accurate finite element solvers. This method not only minimizes the reliance on costly experimental tests and extensive computational resources for finite element analysis but also accelerates the design and optimization of complex HBM systems, making it a valuable tool for improving thermal management and performance in high-performance computing applications.