Xin Zhang

Shengdong Han, Shangdong Yang, Xin Zhang et al.

Resolving closely-spaced small targets in dense clusters presents a significant challenge in infrared imaging, as the overlapping signals hinder precise determination of their quantity, sub-pixel positions, and radiation intensities. While deep learning has advanced the field of infrared small target detection, its application to closely-spaced infrared small targets has not yet been explored. This gap exists primarily due to the complexity of separating superimposed characteristics and the lack of an open-source infrastructure. In this work, we propose the Dynamic Iterative Shrinkage Thresholding Network (DISTA-Net), which reconceptualizes traditional sparse reconstruction within a dynamic framework. DISTA-Net adaptively generates convolution weights and thresholding parameters to tailor the reconstruction process in real time. To the best of our knowledge, DISTA-Net is the first deep learning model designed specifically for the unmixing of closely-spaced infrared small targets, achieving superior sub-pixel detection accuracy. Moreover, we have established the first open-source ecosystem to foster further research in this field. This ecosystem comprises three key components: (1) CSIST-100K, a publicly available benchmark dataset; (2) CSO-mAP, a custom evaluation metric for sub-pixel detection; and (3) GrokCSO, an open-source toolkit featuring DISTA-Net and other models. Our code and dataset are available at https://github.com/GrokCV/GrokCSO.

Chien-Fu, Huang, Katherine Sieg et al.

Controlling defects in semiconductor processes is important for maintaining yield, improving production cost, and preventing time-dependent critical component failures. Electron beam-based imaging has been used as a tool to survey wafers in the line and inspect for defects. However, manual classification of images for these nano-scale defects is limited by time, labor constraints, and human biases. In recent years, deep learning computer vision algorithms have shown to be effective solutions for image-based inspection applications in industry. This work proposes application of vision transformer (ViT) neural networks for automatic defect classification (ADC) of scanning electron microscope (SEM) images of wafer defects. We evaluated our proposed methods on 300mm wafer semiconductor defect data from our fab in IBM Albany. We studied 11 defect types from over 7400 total images and investigated the potential of transfer learning of DinoV2 and semi-supervised learning for improved classification accuracy and efficient computation. We were able to achieve classification accuracies of over 90% with less than 15 images per defect class. Our work demonstrates the potential to apply the proposed framework for a platform agnostic in-house classification tool with faster turnaround time and flexibility.