Xueqing Li

h-index35
2papers
4,906citations

2 Papers

1.2ARJul 6, 2023
TL-nvSRAM-CIM: Ultra-High-Density Three-Level ReRAM-Assisted Computing-in-nvSRAM with DC-Power Free Restore and Ternary MAC Operations

Dengfeng Wang, Liukai Xu, Songyuan Liu et al.

Accommodating all the weights on-chip for large-scale NNs remains a great challenge for SRAM based computing-in-memory (SRAM-CIM) with limited on-chip capacity. Previous non-volatile SRAM-CIM (nvSRAM-CIM) addresses this issue by integrating high-density single-level ReRAMs on the top of high-efficiency SRAM-CIM for weight storage to eliminate the off-chip memory access. However, previous SL-nvSRAM-CIM suffers from poor scalability for an increased number of SL-ReRAMs and limited computing efficiency. To overcome these challenges, this work proposes an ultra-high-density three-level ReRAMs-assisted computing-in-nonvolatile-SRAM (TL-nvSRAM-CIM) scheme for large NN models. The clustered n-selector-n-ReRAM (cluster-nSnRs) is employed for reliable weight-restore with eliminated DC power. Furthermore, a ternary SRAM-CIM mechanism with differential computing scheme is proposed for energy-efficient ternary MAC operations while preserving high NN accuracy. The proposed TL-nvSRAM-CIM achieves 7.8x higher storage density, compared with the state-of-art works. Moreover, TL-nvSRAM-CIM shows up to 2.9x and 1.9x enhanced energy-efficiency, respectively, compared to the baseline designs of SRAM-CIM and ReRAM-CIM, respectively.

1.2ARNov 23, 2022
A 65nm 8b-Activation 8b-Weight SRAM-Based Charge-Domain Computing-in-Memory Macro Using A Fully-Parallel Analog Adder Network and A Single-ADC Interface

Guodong Yin, Mufeng Zhou, Yiming Chen et al.

Performing data-intensive tasks in the von Neumann architecture is challenging to achieve both high performance and power efficiency due to the memory wall bottleneck. Computing-in-memory (CiM) is a promising mitigation approach by enabling parallel in-situ multiply-accumulate (MAC) operations within the memory with support from the peripheral interface and datapath. SRAM-based charge-domain CiM (CD-CiM) has shown its potential of enhanced power efficiency and computing accuracy. However, existing SRAM-based CD-CiM faces scaling challenges to meet the throughput requirement of high-performance multi-bit-quantization applications. This paper presents an SRAM-based high-throughput ReLU-optimized CD-CiM macro. It is capable of completing MAC and ReLU of two signed 8b vectors in one CiM cycle with only one A/D conversion. Along with non-linearity compensation for the analog computing and A/D conversion interfaces, this work achieves 51.2GOPS throughput and 10.3TOPS/W energy efficiency, while showing 88.6% accuracy in the CIFAR-10 dataset.