Yudong Pan

h-index2
2papers
54citations

2 Papers

19.1ARMar 17, 2024Code
Data is all you need: Finetuning LLMs for Chip Design via an Automated design-data augmentation framework

Kaiyan Chang, Kun Wang, Nan Yang et al.

Recent advances in large language models have demonstrated their potential for automated generation of hardware description language (HDL) code from high-level prompts. Researchers have utilized fine-tuning to enhance the ability of these large language models (LLMs) in the field of Chip Design. However, the lack of Verilog data hinders further improvement in the quality of Verilog generation by LLMs. Additionally, the absence of a Verilog and Electronic Design Automation (EDA) script data augmentation framework significantly increases the time required to prepare the training dataset for LLM trainers. This paper proposes an automated design-data augmentation framework, which generates high-volume and high-quality natural language aligned with Verilog and EDA scripts. For Verilog generation, it translates Verilog files to an abstract syntax tree and then maps nodes to natural language with a predefined template. For Verilog repair, it uses predefined rules to generate the wrong verilog file and then pairs EDA Tool feedback with the right and wrong verilog file. For EDA Script generation, it uses existing LLM(GPT-3.5) to obtain the description of the Script. To evaluate the effectiveness of our data augmentation method, we finetune Llama2-13B and Llama2-7B models using the dataset generated by our augmentation framework. The results demonstrate a significant improvement in the Verilog generation tasks with LLMs. Moreover, the accuracy of Verilog generation surpasses that of the current state-of-the-art open-source Verilog generation model, increasing from 58.8% to 70.6% with the same benchmark. Our 13B model (ChipGPT-FT) has a pass rate improvement compared with GPT-3.5 in Verilog generation and outperforms in EDA script (i.e., SiliconCompiler) generation with only 200 EDA script data.

1.2ARFeb 11
From Buffers to Registers: Unlocking Fine-Grained FlashAttention with Hybrid-Bonded 3D NPU Co-Design

Jinxin Yu, Yudong Pan, Mengdi Wang et al.

Transformer-based models dominate modern AI workloads but exacerbate memory bottlenecks due to their quadratic attention complexity and ever-growing model sizes. Existing accelerators, such as Groq and Cerebras, mitigate off-chip traffic with large on-chip caches, while algorithmic innovations such as FlashAttention fuse operators to avoid materializing large attention matrices. However, as off-chip traffic decreases, our measurements show that on-chip SRAM accesses account for over 60% of energy in long-sequence workloads, making cache access the new bottleneck. We propose 3D-Flow, a hybrid-bonded, 3D-stacked spatial accelerator that enables register-to-register communication across vertically partitioned PE tiers. Unlike 2D multi-array architectures limited by NoC-based router-to-router transfers, 3D-Flow leverages sub-10 um vertical TSVs to sustain cycle-level operator pipelining with minimal overhead. On top of this architecture, we design 3D-FlashAttention, a fine-grained scheduling method that balances latency across tiers, forming a bubble-free vertical dataflow without on-chip SRAM roundtrips. Evaluations on Transformer workloads (OPT and QWEN models) show that our 3D spatial accelerator reduces 46-93% energy consumption and achieves 1.4x-7.6x speedups compared to state-of-the-art 2D and 3D designs.