Yuqi Xue

Haoyang Zhang, Yirui Eric Zhou, Yuqi Xue et al.

To break the GPU memory wall for scaling deep learning workloads, a variety of architecture and system techniques have been proposed recently. Their typical approaches include memory extension with flash memory and direct storage access. However, these techniques still suffer from suboptimal performance and introduce complexity to the GPU memory management, making them hard to meet the scalability requirement of deep learning workloads today. In this paper, we present a unified GPU memory and storage architecture named G10 driven by the fact that the tensor behaviors of deep learning workloads are highly predictable. G10 integrates the host memory, GPU memory, and flash memory into a unified memory space, to scale the GPU memory capacity while enabling transparent data migrations. Based on this unified GPU memory and storage architecture, G10 utilizes compiler techniques to characterize the tensor behaviors in deep learning workloads. Therefore, it can schedule data migrations in advance by considering the available bandwidth of flash memory and host memory. The cooperative mechanism between deep learning compilers and the unified memory architecture enables G10 to hide data transfer overheads in a transparent manner. We implement G10 based on an open-source GPU simulator. Our experiments demonstrate that G10 outperforms state-of-the-art GPU memory solutions by up to 1.75$\times$, without code modifications to deep learning workloads. With the smart data migration mechanism, G10 can reach 90.3\% of the performance of the ideal case assuming unlimited GPU memory.

Yiqi Liu, Yuqi Xue, Yu Cheng et al.

As AI chips incorporate numerous parallelized cores to scale deep learning (DL) computing, inter-core communication is enabled recently by employing high-bandwidth and low-latency interconnect links on the chip (e.g., Graphcore IPU). It allows each core to directly access the fast scratchpad memory in other cores, which enables new parallel computing paradigms. However, without proper support for the scalable inter-core connections in current DL compilers, it is hard for developers to exploit the benefits of this new architecture. We present T10, the first DL compiler to exploit the inter-core communication bandwidth and distributed on-chip memory on AI chips. To formulate the computation and communication patterns of tensor operators in this new architecture, T10 introduces a distributed tensor abstraction rTensor. T10 maps a DNN model to execution plans with a generalized compute-shift pattern, by partitioning DNN computation into sub-operators and mapping them to cores, so that the cores can exchange data following predictable patterns. T10 makes globally optimized trade-offs between on-chip memory consumption and inter-core communication overhead, selects the best execution plan from a vast optimization space, and alleviates unnecessary inter-core communications. Our evaluation with a real inter-core connected AI chip, the Graphcore IPU, shows up to 3.3$\times$ performance improvement, and scalability support for larger models, compared to state-of-the-art DL compilers and vendor libraries.

Yuqi Xue, Yiqi Liu, Lifeng Nai et al.

Cloud platforms today have been deploying hardware accelerators like neural processing units (NPUs) for powering machine learning (ML) inference services. To maximize the resource utilization while ensuring reasonable quality of service, a natural approach is to virtualize NPUs for efficient resource sharing for multi-tenant ML services. However, virtualizing NPUs for modern cloud platforms is not easy. This is not only due to the lack of system abstraction support for NPU hardware, but also due to the lack of architectural and ISA support for enabling fine-grained dynamic operator scheduling for virtualized NPUs. We present Neu10, a holistic NPU virtualization framework. We investigate virtualization techniques for NPUs across the entire software and hardware stack. Neu10 consists of (1) a flexible NPU abstraction called vNPU, which enables fine-grained virtualization of the heterogeneous compute units in a physical NPU (pNPU); (2) a vNPU resource allocator that enables pay-as-you-go computing model and flexible vNPU-to-pNPU mappings for improved resource utilization and cost-effectiveness; (3) an ISA extension of modern NPU architecture for facilitating fine-grained tensor operator scheduling for multiple vNPUs. We implement Neu10 based on a production-level NPU simulator. Our experiments show that Neu10 improves the throughput of ML inference services by up to 1.4$\times$ and reduces the tail latency by up to 4.6$\times$, while improving the NPU utilization by 1.2$\times$ on average, compared to state-of-the-art NPU sharing approaches.

Yiqi Liu, Yuqi Xue, Noelle Crawford et al.

To meet the increasing demand of deep learning (DL) models, AI chips are employing both off-chip memory (e.g., HBM) and high-bandwidth low-latency interconnect for direct inter-core data exchange. However, it is not easy to explore the efficiency of these inter-core connected AI (ICCA) chips, due to a fundamental tussle among compute (per-core execution), communication (inter-core data exchange), and I/O (off-chip data access). In this paper, we develop Elk, a DL compiler framework to maximize the efficiency of ICCA chips by jointly trading off all the three performance factors discussed above. Elk structures these performance factors into configurable parameters and forms a global trade-off space in the DL compiler. To systematically explore this space and maximize overall efficiency, Elk employs a new inductive operator scheduling policy and a cost-aware on-chip memory allocation algorithm. It generates globally optimized execution plans that best overlap off-chip data loading and on-chip execution. To examine the efficiency of Elk, we build a full-fledged emulator based on a real ICCA chip IPU-POD4, and an ICCA chip simulator for sensitivity analysis with different interconnect network topologies. Elk achieves 94% of the ideal roofline performance of ICCA chips on average, showing the benefits of supporting large DL models on ICCA chips. We also show Elk's capability of enabling architecture design space exploration for new ICCA chip development.