Faysal Boughorbel

Joaquín Figueira, Rob Van Gastel, Giacomo D'Amicantonio et al.

Segmentation models in automated optical inspection of wire-bonded semiconductors are typically device-specific and must be re-trained when new devices or distribution shifts appear. We introduce AOI-SSL, a training-efficient framework for semantic segmentation of wire-bonded semiconductors by combining small-domain self-supervised pre-training of vision transformers with in-context inference that minimizes the need of labeled examples. We pre-train SOTA self-supervised algorithms in a small industrial inspection dataset and find that Masked Autoencoders are the most effective in this small-data setting, improving downstream segmentation while reducing the labeled fine-tuning effort. We further introduce in-context, patch-level retrieval methods that predict masks directly from dense encoder embeddings with negligible additional training. We show that, in this setting, simple similarity-based retrieval performs on par with more complex attention-based aggregation used currently in the literature. Furthermore, our experiments demonstrate that self-supervised pre-training significantly improves segmentation quality compared to training from scratch and to ImageNet pre-trained backbones under a fixed fine-tuning computational budget. Finally, the results reveal that retrieval based segmentation outperforms fine-tuning when targeting single device images, allowing for near-instant adaptation to difficult samples.

David Leeftink, Roman Doll, Heleen Visserman et al.

Laser dicing of semiconductor wafers is a critical step in microelectronic manufacturing, where multiple sequential laser passes precisely separate individual dies from the wafer. Adapting this complex sequential process to new wafer materials typically requires weeks of expert effort to balance process speed, separation quality, and material integrity. We present the first automated discovery of production-ready laser dicing processes on an industrial LASER1205 dicing system. We formulate the problem as a high-dimensional, constrained multi-objective Bayesian optimization task, and introduce a sequential two-level fidelity strategy to minimize expensive destructive die-strength evaluations. On bare silicon and product wafers, our method autonomously delivers feasible configurations that match or exceed expert baselines in production speed, die strength, and structural integrity, using only technician-level operation. Post-hoc validation of different weight configurations of the utility functions reveals that multiple feasible solutions with qualitatively different trade-offs can be obtained from the final surrogate model. Expert-refinement of the discovered process can further improve production speed while preserving die strength and structural integrity, surpassing purely manual or automated methods.

Kieran Carrigg, Rob van Gastel, Melda Yeghaian et al.

Masked Autoencoder (MAE) pre-training of vision transformers (ViTs) yields strong performance in low-label regimes but comes with substantial computational costs, making it impractical in time- and resource-constrained industrial settings. We address this by integrating Decorrelated Backpropagation (DBP) into MAE pre-training, an optimization method that iteratively reduces input correlations at each layer to accelerate convergence. Applied selectively to the encoder, DBP achieves faster pre-training without loss of stability. On ImageNet-1K pre-training with ADE20K fine-tuning, DBP-MAE reduces wall-clock time to baseline performance by 21.1%, lowers carbon emissions by 21.4% and improves segmentation mIoU by 1.1 points. We observe similar gains when pre-training and fine-tuning on proprietary industrial data, confirming the method's applicability in real-world scenarios. These results demonstrate that DBP can reduce training time and energy use while improving downstream performance for large-scale ViT pre-training.