Xiang Liu

Peng Wang, Xiang Liu, Peidong Liu

Stylizing 3D scenes instantly while maintaining multi-view consistency and faithfully resembling a style image remains a significant challenge. Current state-of-the-art 3D stylization methods typically involve computationally intensive test-time optimization to transfer artistic features into a pretrained 3D representation, often requiring dense posed input images. In contrast, leveraging recent advances in feed-forward reconstruction models, we demonstrate a novel approach to achieve direct 3D stylization in less than a second using unposed sparse-view scene images and an arbitrary style image. To address the inherent decoupling between reconstruction and stylization, we introduce a branched architecture that separates structure modeling and appearance shading, effectively preventing stylistic transfer from distorting the underlying 3D scene structure. Furthermore, we adapt an identity loss to facilitate pre-training our stylization model through the novel view synthesis task. This strategy also allows our model to retain its original reconstruction capabilities while being fine-tuned for stylization. Comprehensive evaluations, using both in-domain and out-of-domain datasets, demonstrate that our approach produces high-quality stylized 3D content that achieve a superior blend of style and scene appearance, while also outperforming existing methods in terms of multi-view consistency and efficiency.

Qianru Zhang, Meng Zhang, Chinthaka Gamanayake et al.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.