Shimeng Yu

AR
h-index14
11papers
734citations
Novelty38%
AI Score50

11 Papers

LGApr 13
Physics-informed AI Accelerated Retention Analysis of Ferroelectric Vertical NAND: From Day-Scale TCAD to Second-Scale Surrogate Model

Gyujun Jeong, Sungwon Cho, Minji Shon et al.

Ferroelectric field-effect transistors (FeFET)-based vertical NAND (Fe-VNAND) has emerged as a promising candidate to overcome z-scaling limitations with lower programming voltages. However, the data retention of 3D Fe-VNAND is hindered by the complex interaction between charge detrapping and ferroelectric depolarization. Developing optimized device designs requires exploring an extensive parameter space, but the high computational cost of conventional Technology Computer-Aided Design (TCAD) tools makes such wide-scale optimization impractical. To overcome these simulation barriers, we present a Physics-Informed Neural Operator (PINO)-based AI surrogate model designed for high-efficiency prediction of threshold voltage (Vth) shifts and retention behavior. By embedding fundamental physical principles into the learning architecture, our PINO framework achieves a speedup exceeding 10000x compared to TCAD while maintaining physical accuracy. This study demonstrates the model's effectiveness on a single FeFET configuration, serving as a pathway toward modeling the retention loss mechanisms.

ARMar 29
Proxima: Near-storage Acceleration for Graph-based Approximate Nearest Neighbor Search in 3D NAND

Weihong Xu, Junwei Chen, Po-Kai Hsu et al.

Approximate nearest neighbor search (ANNS) plays an indispensable role in a wide variety of applications, including recommendation systems, information retrieval, and semantic search. Among the cutting-edge ANNS algorithms, graph-based approaches provide superior accuracy and scalability on massive datasets. However, the best-performing graph-based ANN search solutions incur tens of hundreds of memory footprints as well as costly distance computation, thus hindering their efficient deployment at scale. The 3D NAND flash is emerging as a promising device for data-intensive applications due to its high density and nonvolatility. In this work, we present the near-storage processing (NSP)-based ANNS solution Proxima, to accelerate graph-based ANNS with algorithm-hardware co-design in 3D NAND flash. Proxima significantly reduces the complexity of graph search by leveraging the distance approximation and early termination. On top of the algorithmic enhancement, we implement Proxima search algorithm in 3D NAND flash using the heterogeneous integration technique. To maximize 3D NAND's bandwidth utilization, we present customized dataflow and optimized data allocation scheme. Our evaluation results show that: compared to graph ANNS on CPU and GPU, Proxima achieves a magnitude improvement in throughput or energy efficiency. Proxima yields 7x to 13x speedup over existing ASIC designs. Furthermore, Proxima achieves a good balance between accuracy, efficiency and storage density compared to previous NSP-based accelerators.

ARMay 5, 2025Code
NeuroSim V1.5: Improved Software Backbone for Benchmarking Compute-in-Memory Accelerators with Device and Circuit-level Non-idealities

James Read, Ming-Yen Lee, Wei-Hsing Huang et al.

The exponential growth of artificial intelligence (AI) applications has exposed the inefficiency of conventional von Neumann architectures, where frequent data transfers between compute units and memory create significant energy and latency bottlenecks. Analog Computing-in-Memory (ACIM) addresses this challenge by performing multiply-accumulate (MAC) operations directly in the memory arrays, substantially reducing data movement. However, designing robust ACIM accelerators requires accurate modeling of device- and circuit-level non-idealities. In this work, we present NeuroSim V1.5, introducing several key advances: (1) seamless integration with TensorRT's post-training quantization flow enabling support for more neural networks including transformers, (2) a flexible noise injection methodology built on pre-characterized statistical models, making it straightforward to incorporate data from SPICE simulations or silicon measurements, (3) expanded device support including emerging non-volatile capacitive memories, and (4) up to 6.5x faster runtime than NeuroSim V1.4 through optimized behavioral simulation. The combination of these capabilities uniquely enables systematic design space exploration across both accuracy and hardware efficiency metrics. Through multiple case studies, we demonstrate optimization of critical design parameters while maintaining network accuracy. By bridging high-fidelity noise modeling with efficient simulation, NeuroSim V1.5 advances the design and validation of next-generation ACIM accelerators. All NeuroSim versions are available open-source at https://github.com/neurosim/NeuroSim.

ROJan 6, 2022Code
A wearable sensor vest for social humanoid robots with GPGPU, IoT, and modular software architecture

Mohsen Jafarzadeh, Stephen Brooks, Shimeng Yu et al.

Currently, most social robots interact with their surroundings and humans through sensors that are integral parts of the robots, which limits the usability of the sensors, human-robot interaction, and interchangeability. A wearable sensor garment that fits many robots is needed in many applications. This article presents an affordable wearable sensor vest, and an open-source software architecture with the Internet of Things (IoT) for social humanoid robots. The vest consists of touch, temperature, gesture, distance, vision sensors, and a wireless communication module. The IoT feature allows the robot to interact with humans locally and over the Internet. The designed architecture works for any social robot that has a general-purpose graphics processing unit (GPGPU), I2C/SPI buses, Internet connection, and the Robotics Operating System (ROS). The modular design of this architecture enables developers to easily add/remove/update complex behaviors. The proposed software architecture provides IoT technology, GPGPU nodes, I2C and SPI bus mangers, audio-visual interaction nodes (speech to text, text to speech, and image understanding), and isolation between behavior nodes and other nodes. The proposed IoT solution consists of related nodes in the robot, a RESTful web service, and user interfaces. We used the HTTP protocol as a means of two-way communication with the social robot over the Internet. Developers can easily edit or add nodes in C, C++, and Python programming languages. Our architecture can be used for designing more sophisticated behaviors for social humanoid robots.

ARMar 12
System-Technology Co-Optimization of Bitline Routing and Bonding Pathways in Monolithic 3D DRAM Architectures

Kiseok Lee, Sungwon Cho, Seongkwang Lim et al.

3D DRAM has emerged as a promising approach for continued density scaling, but its viability is limited by routing and hybrid bonding constraints to periphery, which may degrade sensing margin, latency, and array efficiency. With device characteristics and array parasitics extracted from TCAD, SPICE simulations are performed with peri logic in a CMOS-Bonded-Array (CBA). The analysis shows that the bitline strap architecture with amorphous oxide semiconductor (AOS) selectors is essential to manage routing congestion and parasitics. The optimized design achieves a bit density of 2.6 Gb/mm^2 (137 layers with Si access transistors or 87 layers with AOS), representing ~6x density scaling over D1b 2D DRAM. The design further demonstrates a nominal row cycle time (tRC) of 10.5 ns, compared to 21.3 ns in D1b, and a 60% reduction in read/write energy.

AROct 6, 2025
Stratum: System-Hardware Co-Design with Tiered Monolithic 3D-Stackable DRAM for Efficient MoE Serving

Yue Pan, Zihan Xia, Po-Kai Hsu et al.

As Large Language Models (LLMs) continue to evolve, Mixture of Experts (MoE) architecture has emerged as a prevailing design for achieving state-of-the-art performance across a wide range of tasks. MoE models use sparse gating to activate only a handful of expert sub-networks per input, achieving billion-parameter capacity with inference costs akin to much smaller models. However, such models often pose challenges for hardware deployment due to the massive data volume introduced by the MoE layers. To address the challenges of serving MoE models, we propose Stratum, a system-hardware co-design approach that combines the novel memory technology Monolithic 3D-Stackable DRAM (Mono3D DRAM), near-memory processing (NMP), and GPU acceleration. The logic and Mono3D DRAM dies are connected through hybrid bonding, whereas the Mono3D DRAM stack and GPU are interconnected via silicon interposer. Mono3D DRAM offers higher internal bandwidth than HBM thanks to the dense vertical interconnect pitch enabled by its monolithic structure, which supports implementations of higher-performance near-memory processing. Furthermore, we tackle the latency differences introduced by aggressive vertical scaling of Mono3D DRAM along the z-dimension by constructing internal memory tiers and assigning data across layers based on access likelihood, guided by topic-based expert usage prediction to boost NMP throughput. The Stratum system achieves up to 8.29x improvement in decoding throughput and 7.66x better energy efficiency across various benchmarks compared to GPU baselines.

LGApr 13, 2021
Mitigating Adversarial Attack for Compute-in-Memory Accelerator Utilizing On-chip Finetune

Shanshi Huang, Hongwu Jiang, Shimeng Yu

Compute-in-memory (CIM) has been proposed to accelerate the convolution neural network (CNN) computation by implementing parallel multiply and accumulation in analog domain. However, the subsequent processing is still preferred to be performed in digital domain. This makes the analog to digital converter (ADC) critical in CIM architectures. One drawback is the ADC error introduced by process variation. While research efforts are being made to improve ADC design to reduce the offset, we find that the accuracy loss introduced by the ADC error could be recovered by model weight finetune. In addition to compensate ADC offset, on-chip weight finetune could be leveraged to provide additional protection for adversarial attack that aims to fool the inference engine with manipulated input samples. Our evaluation results show that by adapting the model weights to the specific ADC offset pattern to each chip, the transferability of the adversarial attack is suppressed. For a chip being attacked by the C&W method, the classification for CIFAR-10 dataset will drop to almost 0%. However, when applying the similarly generated adversarial examples to other chips, the accuracy could still maintain more than 62% and 85% accuracy for VGG-8 and DenseNet-40, respectively.

ETMar 13, 2020
DNN+NeuroSim V2.0: An End-to-End Benchmarking Framework for Compute-in-Memory Accelerators for On-chip Training

Xiaochen Peng, Shanshi Huang, Hongwu Jiang et al.

DNN+NeuroSim is an integrated framework to benchmark compute-in-memory (CIM) accelerators for deep neural networks, with hierarchical design options from device-level, to circuit-level and up to algorithm-level. A python wrapper is developed to interface NeuroSim with a popular machine learning platform: Pytorch, to support flexible network structures. The framework provides automatic algorithm-to-hardware mapping, and evaluates chip-level area, energy efficiency and throughput for training or inference, as well as training/inference accuracy with hardware constraints. Our prior work (DNN+NeuroSim V1.1) was developed to estimate the impact of reliability in synaptic devices, and analog-to-digital converter (ADC) quantization loss on the accuracy and hardware performance of inference engines. In this work, we further investigated the impact of the analog emerging non-volatile memory non-ideal device properties for on-chip training. By introducing the nonlinearity, asymmetry, device-to-device and cycle-to-cycle variation of weight update into the python wrapper, and peripheral circuits for error/weight gradient computation in NeuroSim core, we benchmarked CIM accelerators based on state-of-the-art SRAM and eNVM devices for VGG-8 on CIFAR-10 dataset, revealing the crucial specs of synaptic devices for on-chip training. The proposed DNN+NeuroSim V2.0 framework is available on GitHub.

ETSep 16, 2019
High-Throughput In-Memory Computing for Binary Deep Neural Networks with Monolithically Integrated RRAM and 90nm CMOS

Shihui Yin, Xiaoyu Sun, Shimeng Yu et al.

Deep learning hardware designs have been bottlenecked by conventional memories such as SRAM due to density, leakage and parallel computing challenges. Resistive devices can address the density and volatility issues, but have been limited by peripheral circuit integration. In this work, we demonstrate a scalable RRAM based in-memory computing design, termed XNOR-RRAM, which is fabricated in a 90nm CMOS technology with monolithic integration of RRAM devices between metal 1 and 2. We integrated a 128x64 RRAM array with CMOS peripheral circuits including row/column decoders and flash analog-to-digital converters (ADCs), which collectively become a core component for scalable RRAM-based in-memory computing towards large deep neural networks (DNNs). To maximize the parallelism of in-memory computing, we assert all 128 wordlines of the RRAM array simultaneously, perform analog computing along the bitlines, and digitize the bitline voltages using ADCs. The resistance distribution of low resistance states is tightened by write-verify scheme, and the ADC offset is calibrated. Prototype chip measurements show that the proposed design achieves high binary DNN accuracy of 98.5% for MNIST and 83.5% for CIFAR-10 datasets, respectively, with energy efficiency of 24 TOPS/W and 158 GOPS throughput. This represents 5.6X, 3.2X, 14.1X improvements in throughput, energy-delay product (EDP), and energy-delay-squared product (ED2P), respectively, compared to the state-of-the-art literature. The proposed XNOR-RRAM can enable intelligent functionalities for area-/energy-constrained edge computing devices.

NEMay 23, 2018
Large-Scale Neuromorphic Spiking Array Processors: A quest to mimic the brain

Chetan Singh Thakur, Jamal Molin, Gert Cauwenberghs et al.

Neuromorphic engineering (NE) encompasses a diverse range of approaches to information processing that are inspired by neurobiological systems, and this feature distinguishes neuromorphic systems from conventional computing systems. The brain has evolved over billions of years to solve difficult engineering problems by using efficient, parallel, low-power computation. The goal of NE is to design systems capable of brain-like computation. Numerous large-scale neuromorphic projects have emerged recently. This interdisciplinary field was listed among the top 10 technology breakthroughs of 2014 by the MIT Technology Review and among the top 10 emerging technologies of 2015 by the World Economic Forum. NE has two-way goals: one, a scientific goal to understand the computational properties of biological neural systems by using models implemented in integrated circuits (ICs); second, an engineering goal to exploit the known properties of biological systems to design and implement efficient devices for engineering applications. Building hardware neural emulators can be extremely useful for simulating large-scale neural models to explain how intelligent behavior arises in the brain. The principle advantages of neuromorphic emulators are that they are highly energy efficient, parallel and distributed, and require a small silicon area. Thus, compared to conventional CPUs, these neuromorphic emulators are beneficial in many engineering applications such as for the porting of deep learning algorithms for various recognitions tasks. In this review article, we describe some of the most significant neuromorphic spiking emulators, compare the different architectures and approaches used by them, illustrate their advantages and drawbacks, and highlight the capabilities that each can deliver to neural modelers.

NEDec 25, 2015
Device and System Level Design Considerations for Analog-Non-Volatile-Memory Based Neuromorphic Architectures

Sukru Burc Eryilmaz, Duygu Kuzum, Shimeng Yu et al.

This paper gives an overview of recent progress in the brain inspired computing field with a focus on implementation using emerging memories as electronic synapses. Design considerations and challenges such as requirements and design targets on multilevel states, device variability, programming energy, array-level connectivity, fan-in/fanout, wire energy, and IR drop are presented. Wires are increasingly important in design decisions, especially for large systems, and cycle-to-cycle variations have large impact on learning performance.