Machine Learning based CVD Virtual Metrology in Mass Produced Semiconductor Process
This addresses quality control in mass-produced semiconductor wafers, but it is incremental as it optimizes existing methods for a specific domain.
The paper tackled virtual metrology for chemical vapor deposition in semiconductor manufacturing by benchmarking data imputing, feature selection, and regression algorithms, finding that a nonlinear feature selection and regression algorithm with nearest data imputing achieves a prediction accuracy of 0.7, reducing CVD processing variation by 70%.
A cross-benchmark has been done on three critical aspects, data imputing, feature selection and regression algorithms, for machine learning based chemical vapor deposition (CVD) virtual metrology (VM). The result reveals that linear feature selection regression algorithm would extensively under-fit the VM data. Data imputing is also necessary to achieve a higher prediction accuracy as the data availability is only ~70% when optimal accuracy is obtained. This work suggests a nonlinear feature selection and regression algorithm combined with nearest data imputing algorithm would provide a prediction accuracy as high as 0.7. This would lead to 70% reduced CVD processing variation, which is believed to will lead to reduced frequency of physical metrology as well as more reliable mass-produced wafer with improved quality.