A Survey of Detection Methods for Die Attachment and Wire Bonding Defects in Integrated Circuit Manufacturing
It addresses defect detection in IC manufacturing, which is critical for reliability, but is an incremental survey rather than new research.
This paper surveys methods for detecting die attachment and wire bonding defects in integrated circuit manufacturing, covering optical, radiological, acoustical, and infrared thermography sensing modalities, including both conventional and deep learning approaches.
Defect detection plays a vital role in the manufacturing process of integrated circuits (ICs). Die attachment and wire bonding are two steps of the manufacturing process that determine the power and signal transmission quality and dependability in an IC. This paper presents a survey or literature review of the methods used for detecting these defects based on different sensing modalities used including optical, radiological, acoustical, and infrared thermography. A discussion of the detection methods used is provided in this survey. Both conventional and deep learning approaches for detecting die attachment and wire bonding defects are considered along with challenges and future research directions.