Representation Learning of Complex Assemblies, An Effort to Improve Corporate Scope 3 Emissions Calculation
This work addresses data limitations in environmental impact calculations for corporations, though it appears incremental as it builds on existing graph embedding methods for a specific domain.
The paper tackles the problem of inaccurate climate impact assessments due to limited data in process life cycle analysis (pLCA) for corporate Scope 3 emissions, by proposing a semi-supervised learning framework to identify substitute parts in electronics hardware, resulting in improved performance and generalization over existing models.
Climate change is a pressing global concern for governments, corporations, and citizens alike. This concern underscores the necessity for these entities to accurately assess the climate impact of manufacturing goods and providing services. Tools like process life cycle analysis (pLCA) are used to evaluate the climate impact of production, use, and disposal, from raw material mining through end-of-life. pLCA further enables practitioners to look deeply into material choices or manufacturing processes for individual parts, sub-assemblies, assemblies, and the final product. Reliable and detailed data on the life cycle stages and processes of the product or service under study are not always available or accessible, resulting in inaccurate assessment of climate impact. To overcome the data limitation and enhance the effectiveness of pLCA to generate an improved environmental impact profile, we are adopting an innovative strategy to identify alternative parts, products, and components that share similarities in terms of their form, function, and performance to serve as qualified substitutes. Focusing on enterprise electronics hardware, we propose a semi-supervised learning-based framework to identify substitute parts that leverages product bill of material (BOM) data and a small amount of component-level qualified substitute data (positive samples) to generate machine knowledge graph (MKG) and learn effective embeddings of the components that constitute electronic hardware. Our methodology is grounded in attributed graph embeddings and introduces a strategy to generate biased negative samples to significantly enhance the training process. We demonstrate improved performance and generalization over existing published models.