IMSYSYMay 11

High-speed single-photoelectron detection for Cherenkov astronomy

arXiv:2605.1041127.5
Predicted impact top 72% in IM · last 90 daysOriginality Incremental advance
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This work provides a scalable, high-performance detector solution for imaging atmospheric Cherenkov telescopes, enabling improved timing and resolution in large-area camera modules.

The authors present a co-designed SiPM sensor and ASIC that achieves single-photoelectron resolution with sub-4 ns impulse response and linear response from 1 to 130 photoelectrons, addressing the need for high-speed, low-noise detection in Cherenkov astronomy.

Silicon photomultipliers are increasingly replacing photomultiplier tubes in Cherenkov telescope cameras, but achieving single-photoelectron resolution with nanosecond timing in a low-noise, scalable detector system remains challenging. We present a co-designed SiPM sensor and front-end application specific integrated circuit (ASIC) that meets these requirements. The custom hexagonal sensor, developed with Hamamatsu Photonics, incorporates an integrated optical filter and fourfold pixel segmentation. The readout is performed by a second prototype of the FANSIC ASIC, optimized for this application and fabricated in 65~nm standard CMOS technology, it provides eight channels with on-chip analog summing of sub-channels on a $3.5\times 3.5~\mathrm{mm}^2$ die, while consuming only 24~mW per channel. We demonstrate clear single-photoelectron peak separation with a gain of $2.7 \times 10^{-12}~ \mathrm{V \cdot s}$ , and an impulse response below 4~ns full width at half maximum with a 1.7 ns rise time, preserving the nanosecond-scale structure of Cherenkov pulses. The system responds linearly from 1 to 130 photoelectrons, and 55 distinct photoelectron peaks are resolved by varying the source intensity. These results demonstrate that the integrated sensor-electronics architecture delivers the speed, resolution, and dynamic range required for imaging atmospheric Cherenkov telescopes, and provides a scalable path toward large-area camera modules.

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