An Enhanced Submodule for Modular Multilevel Converter with DC Fault Ride-Through Capability
For power electronics engineers, this is an incremental improvement to existing submodule designs for MMCs.
The paper proposes an enhanced submodule for modular multilevel converters that reduces total required capacitance by 75% compared to the diode-clamp submodule while maintaining DC fault ride-through capability, and requires one fewer diode, lowering capital cost.
Modular multilevel converter (MMC) has been successfully applied in various power electronic systems owing to its high efficiency, scalability, and superior output performance. Although the half-bridge submodule (HBSM) is widely used in MMCs for its structural simplicity, it is incapable of handling direct-current (DC) short-circuit faults. The diode-clamp submodule (DCSM) addresses this limitation by providing DC fault ride-through capability. However, because its two identical capacitors are connected in series, the equivalent capacitance is halved. To overcome this drawback, an enhanced SM is proposed in this paper. For the same energy storage capacity, the proposed SM reduces the total required capacitance by 75% compared with the DCSM. In addition, the proposed SM requires one fewer diode than the DCSM, thereby lowering the overall MMC capital cost. The topology and the operating modes of the proposed SM are described in detail, and its functionality is experimentally validated. The results demonstrate that the proposed SM can suppress DC fault currents and restore normal operation without additional external protection devices.