Deployment of ARX Models for Thermal Forecasting in Power Electronics Boards Using WBG Semiconductors
This addresses thermal forecasting problems for power electronics engineers, offering a reliable alternative to complex simulations, though it appears incremental as it applies an existing method to a specific domain.
The study tackled thermal management challenges in Wide Bandgap semiconductor power electronics by using ARX parametric models for temperature forecasting, achieving accurate predictions without detailed physical property knowledge and simplifying system identification compared to FEM simulations.
Facing the thermal management challenges of Wide Bandgap (WBG) semiconductors, this study highlights the use of ARX parametric models, which provide accurate temperature predictions without requiring detailed understanding of component thickness disparities or material physical properties, relying solely on experimental measurements. These parametric models emerge as a reliable alternative to FEM simulations and conventional thermal models, significantly simplifying system identification while ensuring high result accuracy.