Open3DBench: Open-Source Benchmark for 3D-IC Backend Implementation and PPA Evaluation
It provides a standardized, reproducible platform for 3D EDA methods, bridging the gap between open-source and commercial tools in 3D-IC design, which is incremental as it builds upon existing frameworks.
This work tackles the problem of evaluating 3D-IC backend implementation by introducing Open3DBench, an open-source benchmark that enables comprehensive assessment of power, performance, area, and thermal metrics, resulting in significant improvements such as 51.19% area reduction and 30.84% timing gain compared to 2D flows.
This work introduces Open3DBench, an open-source 3D-IC backend implementation benchmark built upon the OpenROAD-flow-scripts framework, enabling comprehensive evaluation of power, performance, area, and thermal metrics. Our proposed flow supports modular integration of 3D partitioning, placement, 3D routing, RC extraction, and thermal simulation, aligning with advanced 3D flows that rely on commercial tools and in-house scripts. We present two foundational 3D placement algorithms: Open3D-Tiling, which emphasizes regular macro placement, and Open3D-DMP, which enhances wirelength optimization through cross-die co-placement with analytical placer DREAMPlace. Experimental results show significant improvements in area (51.19%), wirelength (24.06%), timing (30.84%), and power (5.72%) compared to 2D flows. The results also highlight that better wirelength does not necessarily lead to PPA gain, emphasizing the need of developing PPA-driven methods. Open3DBench offers a standardized, reproducible platform for evaluating 3D EDA methods, effectively bridging the gap between open-source tools and commercial solutions in 3D-IC design.